Xinxiang SKEF Machinery Co., Ltd
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DM1200 high-precision single-sided grinding machine/polishing machine
Product introduction: DM1200 high-precision single-sided grinding/polishing machine Working principle: SKF high-precision single-sided grinding and po
Product details

DM1200 high-precision single-sided grinding machine/polishing machine

working principle:

SKF high-precisionSingle sided grinding and polishing machineDMThe series is a multifunctional precision grinding and polishing machine suitable for grinding and polishing various hard and soft material surfaces, giving the workpiece surface a high degree of flatness and surface smoothness.

The workpiece is placed on a grinding disc, which rotates counterclockwise. Friction causes the workpiece to rotate, and pneumatic pressure applies pressure to the workpiece. The workpiece and the grinding disc experience relative friction to achieve the purpose of grinding and polishing the workpiece.

SKFThe single-sided grinding and polishing machine is suitable for grinding and polishing small and large-sized workpieces. The production of these parts can range from small-scale production to large-scale production. The equipment is equipped with a digital control system and electronic monitoring devices.


characteristic:

1. Pneumatic loading grinder, Pneumatic handling of pressure plates during loading and unloading, and additional pressure can also be applied to the workpiece according to processing requirements.

2. Security protection functionThe pressure plate can be locked at any position to prevent it from falling in the event of sudden disconnection of the gas or power supplyDamaging personnel or workpieces.


Application field:

Mechanical industry: Automotive sealing valve plate, Piston pump valve plate, automotive sealing valve seat, Carburetor impeller, hard alloy ring, alumina ceramic, Zirconia ceramics, Stainless steel, alloys, Piston rings, mechanical seals, ceramic grinding discs

Semiconductor industry: single-sided polishing of optical crystals, optical glass, watch glass, sapphire substrates, semiconductor silicon wafers, quartz crystal wafers, piezoelectric ceramics, gallium arsenide, lithium niobate, molybdenum sheets, as well as metal and non-metal materials such as graphite, gemstones, copper, etc.


Technical parameters:


lSand wheel disc: outer diameter x inner diameter x thickness (mm) 1120 x 276 x 55 (including abrasive layer 5mm)

l Number of loaded disks 4

lGrinding disc speed(rpm) 5~80

lSpindle motor(kw) 11

lCenter wheel speed(rpm) 5~60
l Central wheel motor(kw) 3

loverall dimensionL×B×H(mm)2000×1500×2500

lMachine weight(kg)3500

lMachine tool intake pressure(MPa) 0.6


Device video:



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